10mm Heatsink Kit 10×10 mm + pre-applied Thermal Conductive Adhesive Tape, Cooler Heat Sink for Cooling BGA chipset, SOC GPU IC Chips VRAM VGA RAM (10mmx10mmx10mm).
10mm (L) x 10mm (W) x 10mm (H) extruded aluminum heat sink kit is made from 6063-T5 aluminum alloy with high thermal conductivity 201 W/m.K, structure stability and light weight. The heat sink extrusion is in vertical and horizontal grooves, that is greatly increases the heat dissipation function. The surface of extruded aluminum is anodized in black. This kit of heat sink comes with 10x10mm pre-applied thermal conductive adhesive tape (datasheet-8810.pdf), for easy installation and optimum heat conductivity.
20pcs anodized black 10×10 heatsink together with pre-applied thermal conductive adhesive tape is easy to install and efficient in heat conduction from power semiconductor sources BGA. This 10mm heatsink kit is suitable for a variety of applications such as cooling MOS, VRM, IC Chips, etc.