19mm Heatsink Kit 19×19 mm + pre-applied Thermal Conductive Adhesive Tape, Cooler Heat Sink for Cooling BGA chipset, SOC GPU IC Chips VRAM VGA RAM (19mmx19mmx5mm).
19mm (L) x 19mm (W) x 5mm (H) extruded aluminum heat sink kit is made from 6063-T5 aluminum alloy with high thermal conductivity 201 W/m.K, structure stability and light weight. The heat sink extrusion is in vertical and horizontal grooves, that is greatly increases the heat dissipation function. The surface of extruded aluminum is anodized in black. This kit of heat sink comes with 19x19mm pre-applied thermal conductive adhesive tape (datasheet-8810.pdf), for easy installation and optimum heat conductivity.
10 pieces anodized black 19×19 heatsink together with pre-applied thermal conductive adhesive tape is easy to install and efficient in heat conduction from power semiconductor sources BGA. This 19mm heatsink kit is suitable for a variety of cooling applications such as AKK X2, X2P, FX2, X2M, X2-ultimate, FX2-ultimate, FX2-ultimate-mini, FX3-ultimate, Raspberry Pi, LED, FPV transmitter, Vram, RAM, IC Chips, etc.