25mm Heatsink Kit 25x25x10mm + pre-applied Thermal Conductive Adhesive Tape, Cooler Heat Sink for Cooling BGA chipset, SOC GPU IC Chips VRAM VGA RAM (25mmx25mmx10mm).
25mm (L) x 25mm (W) x 10mm (H) extruded aluminum heat sink kit is made from 6063-T5 aluminum alloy with high thermal conductivity, structure stability and light weight. The heat sink extrusion is in vertical and horizontal grooves, that is greatly increases the heat dissipation function. The surface of extruded aluminum is anodized in black. This kit of heat sink comes with 25x25mm pre-applied thermal conductive adhesive tape (datasheet-8810.pdf), for easy installation and optimum heat conductivity.
10pcs anodized black 25×25 heatsink together with pre-applied thermal conductive adhesive tape is easy to install and efficient in heat conduction from power semiconductor sources BGA. This 25mm heat sink kit is suitable for a variety of applications such as LED, FPV transmitter, Vram, RAM, IC Chips, etc.