28mm Heat sink 28x28x10mm

Description

28mm Heatsink Kit 28x28x10mm + pre-applied Thermal Conductive Adhesive Tape, Cooler Heat Sink for Cooling BGA chipset, SOC GPU IC Chips VRAM VGA RAM (28mmx28mmx10mm).

28mm (L) x 28mm (W) x 10mm (H) extruded aluminum heat sink kit is made from 6063-T5 aluminum alloy with high thermal conductivity, structure stability and light weight. The heat sink extrusion is in vertical and horizontal grooves, that is greatly increases the heat dissipation function. The surface of extruded aluminum is anodized in black. This kit of heat sink comes with 28x28mm pre-applied thermal conductive adhesive tape (datasheet-8810.pdf), for easy installation and optimum heat conductivity.

10pcs anodized black 28×28 heatsink together with pre-applied thermal conductive adhesive tape is easy to install and efficient in heat conduction from power semiconductor sources BGA. This 28mm heat sink kit is suitable for a variety of applications such as LED, FPV transmitter, Vram, RAM, IC Chips, etc.

• 28mm aluminum heatsink kit
  
• Material: Extruded Aluminum 6063-T5
• Color: Black
• Coating: Anodized
• Dimension: 28mm x 28mm x 10mm (L*W*H)
• Weight: 0.4 oz /7 gr per piece
• Mounting Style: SMD/SMT
• Fin Style: Vertical
• Number of fins: 8×7
• Pre applied 3M™ 8810 thermal conductive adhesive tape
  
• Tape Thermal Conductivity: 0.60 W/m-K (datasheet-8810.pdf)
• Model No: 282810B10-8810
• Package Includes: 10 pieces 28mm heatsink